Two types of metal coating for surfaces finishing of circuit boards:

 Tin chemical process UNISTAN
 The immersion silver process SILVERSTAN

Tin chemical process UNISTAN

  • Is used in horizontal and vertical process
  • Recommended for printed circuits « fine line » et « micro fine-line »


The process UNISTAN  gives a flat and dense surface which the deposit thickness is between 0.8 and 1.2 microns.

UNISTAN has excellent resistance to oxidation, which enables multiple passages in REFLOW and wave soldering. .

The process  UNISTAN can treat circuit boards single and double sided, multilayer, flexible, and rigid-flex.

The process UNISTAN contains a specific system which provides a high deposition.

UNISTAN is used to treat flexible circuits with technology « reel to reel. »

UNISTAN is recommended for circuits « fine line » and « micro-fine line. »

Tin chemical process UNISTAN


The tin chemical process UNISTAN standard is recommended for circuits « fine line » and « micro-fine line » in production.


UNISTAN S is specially formulated for good compatibility of soldermask and increase the deposition rate in production.


UNISTAN T is a specific formulation which provides a high deposition rate.

The immersion silver process SILVERSTAN


The process SILVERSTAN  produces a dense structure and a regular thickness of the silver deposit as organo-silver for printed circuit boards

The deposit obtained by the method  SILVERSTAN allows good weldability for a period appropriate of storage.

Alternatively to component assembly using lead-based solder, this finish is in conformity with ROHS directive

The process SILVERSTAN can treat circuit boards single and double sided, multilayer, flexible, and rigid-flex. The method is used in SILVERSTAN automatic horizontal and vertical.

SILVERSTAN the process is short and fast. The process SILVERSTAN don’t attack solder mask.