For surface preparation of printed circuits, a high-performance copper microetching The Cleaner Micro-Etch ETCHBRITE NTS 519. It’s a micro-etching process for the preparation of copper for inner layers and outer layers of the printed circuits before photoresist dry film or liquid resin.
The strengths of Cleaner Micro-Etch ETCHBRITE NTS 519 :
- A uniform micro roughness
- Quality of copper preparation in the blind holes and in the buried holes of multilayer printed circuits boards
- Respect for thicknesses of copper in the holes pre-plated
- 40-45 g of copper dissolved which makes economic treatment
- Easy treatment of rinse water
Preparation for Dry film photoresist inner and external layers of PCB
The Cleaner Micro-Etch ETCHBRITE NTS 519 is one of the best products micro-etching on the market, with a copper concentration that makes it a very economical, but the main advantage is the quality of copper micro-etching.
Gallery of pictures of MBE* microetching NTS 519
1- Microetching copper inner layers processed into production
– enlargement x1000 –
2 – Microetching copper inner layers processed into production
– enlargement x2000 –
3 – Microetching copper inner layers, uniform appearance of copper
– enlargement x5000 –
4 – Preparation of the copper inner layer with phtoresist
– enlargement x350 –
5 – Microetching of the copper external layers preparation
for dry-film printed circuit
– enlargement x350 –
6 – Microetching of the copper external layers
preparation fordry-film printed circuit
– enlargement x500 –
7 – Microetching of the copper external layers preparation
for dry-film printed circuit
– enlargement x5000 –
(*) MBE : microscope à balayage électronique (electronic scanning microscope)
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